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The constant trend of miniaturization, primarily driven by Moore’s Law, has affected all areas of electronics. Making things smaller doesn’t just make them easier to carry around, it enables a higher density of capabilities and features, as well as higher power densities and efficiencies. Generally, the first things to shrink are the integrated circuits, followed by other components. For many years, MLCCs led the charge in down-sizing, but film capacitors didn’t follow.

In this live webinar, join KEMET’s Hristina Kostadinova Boshkova (R&D Manager) to learn about the advances in film technology that enables downsizing without sacrificing application performance.

Monday, February 15, 2021 @ 9 a.m. EST (USA) | 3 p.m. CET (EUR)

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