3D electronic packages need embeddable DC Link capacitors. When placed close to wide-bandgap (WBG) semiconductors, capacitors can reduce inductance and improve efficiency at the higher frequencies, voltages, and temperatures.
Traditional film capacitors are sometimes not suitable due to their lower operational temperatures. Also, they do not lend themselves to high-density 3D assemblies. Multilayer ceramic capacitors (MLCCs) have both the necessary voltage and temperature capability when built with the proper material set (dielectric).
BME C0G Ceramic DC Link Capacitors
This presentation provides a background on KEMET’s BME C0G technology and how it has been used in higher voltage (up to 2000 V) and higher temperature (over 200°C) applications. The work presented here shows an evaluation of a 3640 sized MLCC DC Link capacitor.
This work was presented at the “International Symposium on 3D Power Electronics Integration and Manufacturing” by Dr. John Bultitude. Additional authors include Lonnie Jones, Buli Xu, Jim Magee, and Reggie Phillips.
These slides are hosted on slideshare.net.
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