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Development of High Temp MLCC and TLPS Materials

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Leaded MLCC capacitors can provide more reliable performance by addressing mismatches in coefficient of thermal expansion while achieving high capacitance. In addition to the reliable performance at temperatures ≥ 175°C some component assembly processes for electronic circuits reach up to 350°C with exposure to multiple temperature excursions during assembly.  These requirements surpass the capability of established interconnect materials such as conventional solders and welds.

The market trends and drivers of the development of high-temperature electronics are reviewed. The maximum shear stress capability of interconnects using solders and welds are compared to those made with novel Pb-free transient liquid phase sintering (TLPS) materials at temperatures up to 300°C. The discussion is focused on the potential benefits of TLPS assembly for high-temperature electronics.

Presentation on KEMET’s Characterization of Transient Liquid Phase Sintering (TLPS) materials and their use in MLCCs. Presented on October 5, 2015, at the Material Science & Technology Conference in Columbus, OH by Dr John Bultitude.

Development of Transient Liquid Phase Sintering (TLPS) for MLCCs from KEMET Electronics Corporation


  • John McConnell
  • Javaid Qazi
  • Jim Magee
  • Lonnie Jones
  • Catherine Shearer
  • Ken Holcomb
  • Michael Matthews

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