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Packaging Ceramic DC Link Capacitors for Wide-Bandgap applications

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Wide-bandgap applications need DC Link and decoupling capacitors that can withstand 200°C, work at 1+ MHz switching frequencies, and support up to 2,000 V. KEMET continues to move forward on developing the most advanced ceramic DC Link capacitor technology.

As a member of the PSMA Packaging Committee, Dr. John Bultitude presents the work his team has done to make ultra-stable, highly robust Ceramic DC Link Capacitors available in Leadless stacks.

This presentation was presented at APEC 2017 in Tampa, FL.

Please note, this paper describes a technology under active development. Please contact us for the latest information on this technology and the products it is producing.

Slides

(These slides are hosted on slideshare.net)

Packaging Ceramic DC Link Capacitors for Wide-Bandgap Applications from KEMET Electronics Corporation

Authors

  • Lonnie Jones
  • Buli Xu
  • Jim Magee
  • Reggie Phillips
  • Peter Blais
  • Axel Schmidt
  • John McConnell
  • Galen Miller
  • Allen Templeton
  • George Haddox
  • Joshua Reid
  • Erik Reed
  • Nathan Reed
  • Javaid Qazi
  • Hector Nieves

Additional Information

A companion paper presented by Dr. Gurav covers the development of end-products based on the technology in this presentation.

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