Creepage Image




Creepage is the shortest path between two conductive parts, or between a conductive part and the bonding surface of the equipment, measured along the surface of the insulation.

Many factors can define the creepage distance of an HV MLCC…not just the termination separation. Solder overrun can shorten the creepage distance, as well as surface contamination (especially on an X7R dielectric that has a more porous surface) related to the end customer’s processing. Contaminants can become trapped in the pores and allow arcing despite rigorous adherence to published creepage specs.

Learn more about Arc Shield Technology, read a whitepaper on ArcShield for Automotive, or see what High-Voltage Ceramic Capacitors KEMET offers.

Added on:

Monday, December 7th, 2015